KE-3020V | High Speed Flexible Mounter
The KE302V is a 7th generation modular placement machine from Juki and represents the latest leading-edge technology for improved flexibility and production quality. It supports a hybrid feeder mix of electronic and mechanical feeders with up to 160 dual lane electronic 8mm tape feeder capacity per machine. Maximum board size is 22”x24”. The KE3020V is the ideal solution for PoP (package on package) placement supporting a linear and rotary fluxer for highly accurate placement.
Specifications
Board Size:
Maximum board size is 22” x 24”
Component Range:
01005 (0402 metric) up to
74mm squared on the KE3020V
Placement Accuracy:
Laser recognition
±0.05mm (±3σ)
Vision Recognition
±0.03mm(MNVC ±0.04mm)
Feeder Inputs:
Max.160 in case of 8mm tape
(on an Electric double tape feeder)
The use of electronic double tape feeders enables mounting of a maximum of 160 component types.
Placement Speed
17,100CPH (IPC9850) for chips and a new and improved speed of up to 9,470CPH (IPC9850) when using the tri-colored camera for ball and lead inspection
Features
High-Speed, On-the-Fly Vision Centering
New on-the-fly vision centering dramatically increases the placement speed by eliminating time wasting stops over the camera. Parallel processing of images means components are ready for placement as soon as the head reaches the placement coordinates.
High-Speed Feeding of Tray Components (Option)
The TR-7D high speed matrix server is equiped with dual magazines and drive systems to present 2 different trays at the same time. This method eliminates time wasted during tray exchange and increases the efficiency of placement.
Vision Centering Technology
Centering method can be selected based on component
type, shape, size and material. Laser centering is used
for high-speed placement of smaller components. Vision
is used when lead or ball inspection is needed or when
the component is too large for the laser. Many nozzles
are available for odd-shaped components providing
unsurpassed component handling.
PoP Placement
Package-on-Package (PoP) assembly is fully supported using either linear or rotary fluxer units that also supports dipping solder paste.
COMPATIBILITY
Reduce costs by maintaining compatibility. This machine is compatible with IS Software.
