KE-1070 | High Speed Chip Shooter

The KE1070 modular placement system is intended to meet the need for reliable, cost efficient placement solutions for the mid-range market. The KE1070 is built using the same topology as the widely popular KE2070/KE2080 machines that have had tremendous success in the market place since their release.

The KE1070 supports auto teaching of the pick position which reduces changeover time and increases pick reliability. The KE1070 is the cost effective solution for high volume production in high-mix environments.

Specifications

Placement Head:
Four nozzle head with LNC60 laser alignment

Placement Rate:
15,500CPH - chip (IPC9850)

Component Range:
01005 (0402 metric) to 33.5 mm square

Placement Accuracy:
Laser alignment (chip placements)
(±50µm) at CPK≥1

Feeder Inputs:
80 single 8mm Tape Feeder

Features

LNC60 High Resolution Laser Sensor:
The KE Series features the LNC60 optical laser centering unit that is built into the head to easily measure components while moving from the pick to the placement site. The LNC60 laser eliminates having to move to a stationary or line scan camera creating a very efficient method of component measurement centering.